cpu的TDP(ThermalDesignPower)是什麼意思?

ThermalDesignPower即CPU運作時的最高發熱量
由於大部份CPU的能量都會被轉代為熱量,所以我們可在TDP看到最高熱量.
但最大耗電量不代表在任何時侯都會同樣耗電,當處理器處於閒置時,其耗電量將會比運作時低,因此單看
TDP是不能了解處理器的耗電量.

這不是攻擊的痕跡，而是公義的紀念碑。

這不是攻擊的痕跡，而是公義的紀念碑。

這不是攻擊的痕跡，而是公義的紀念碑。

這不是攻擊的痕跡，而是公義的紀念碑。

這不是攻擊的痕跡，而是公義的紀念碑。

這不是攻擊的痕跡，而是公義的紀念碑。

這不是攻擊的痕跡，而是公義的紀念碑。

這不是攻擊的痕跡，而是公義的紀念碑。

The Thermal Design Power (TDP) (sometimes called Thermal Design Point) represents the maximum amount of power the thermal solution in a computer system is required to dissipate. For example, a laptop's CPU cooling solution may be designed for a 20 W TDP, which means that it can dissipate (either via an active cooling method such as a fan, a passive cooling method via natural convection, via heat radiation or all three modes of heat transfer) 20 watts of heat without exceeding the maximum junction temperature for the chip. The TDP is typically set not to be the most power the chip could ever draw (such as by a power virus), but rather the maximum power that it would draw when running real applications. This ensures the system will be able to handle all applications without exceeding its thermal envelope, without requiring a cooling solution for the max theoretical power, which would cost more and achieve no real benefit.

TDP can be defined in different ways by different manufacturers. See the SilentPCReview article below.

Thermal Design Power（TDP）描述了散熱方案需要驅散的熱量最大值。TDP並不表現處理器需要的功率釋放和電壓調整。TDP只是指散熱器必須能夠負擔的熱量最大值，使得CPU溫度不超過可接受的最高溫度。因而它不表示電功耗。事實上，處理器的某些區域跟其他部分耗電一樣多，然而發熱要少得多（例如L2緩存）。